Xiaomi XRING O1 Die Shot Reveals Details of 10-Core CPU, 6-Core NPU and More
Xiaomi XRING O1 was unveiled Thursday on the Xiaomi 15S Pro, marking the company's first in-house chipset. Built on TSMC's advanced 3nm N3E process technology, the XRING O1 features a 10-core CPU, 6-core NPU, and 16-core GPU. A die shot of the XRING O1 reveals the layout of various components on the chipset.
Xiaomi XRING O1 was unveiled Thursday on the Xiaomi 15S Pro, marking the company's first in-house chipset. Built on TSMC's advanced 3nm N3E process technology, the XRING O1 features a 10-core CPU, 6-core NPU, and 16-core GPU. A die shot of the XRING O1 reveals the layout of various components on the chipset.
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